| Title: |
A New Equivalent Circuit Scheme for Grounded Back-to-Back GCPW-MS-GCPW Transitions Fabricated on a Thin Low-k Substrate. |
| Authors: |
Dugue, Pierre-Vincent; El-Gibari, Mohammed; Halbwax, Mathieu; Ginestar, Stephane; Avramovic, Vanessa; Vilcot, Jean-Pierre; Hongwu Li |
| Source: |
Progress in Electromagnetics Research Letters; 2021, Vol. 95, p33-42, 10p |
| Subject Terms: |
Transition metals; Benzocyclobutene; Microstrip transmission lines; Bandwidths; Impedance spectroscopy |
| Abstract: |
We hereby present a new equivalent circuit model including both lumped and distributed elements for GCPW-MS transitions (GCPW for Grounded CoplanarWaveguide and MS for Microstrip). In order to validate the modelling results, such transitions have been fabricated on a 20 µm-thick BCB (Benzocyclobutene resin) substrate using grounding pads including via-holes of different diameters. The study focused on the impact of the via-hole diameter on the performance of the transition and more specifically on its bandwidth. The transitions were made using a simple technological process based on photosensitive polymer. ADS simulation data of the new equivalent circuit model were in very good agreement with measured S-parameters. Both theoretical and experimental results have shown that the bandwidth of such a transition can reach up to 100 GHz using via-holes of 900 µm diameter. [ABSTRACT FROM AUTHOR] |
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| Database: |
Complementary Index |