Enhanced temperature coefficient of resistance of amorphous silicon through metal incorporation and decapping process
| Title: | Enhanced temperature coefficient of resistance of amorphous silicon through metal incorporation and decapping process |
|---|---|
| Authors: | Jo, Seong-Jo; Lee, Do-Yeon; Ko, Woon-San; Park, So-Yeong; Hong, Hye-Ri; Lee, Ga-Won ⁎ |
| Source: | In Thin Solid Films 1 July 2026 845 |
| Database: | ScienceDirect |