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Unlocking high-performance Si RF platforms with SiGe HBT and RFSOI switch technologies

Title: Unlocking high-performance Si RF platforms with SiGe HBT and RFSOI switch technologies
Authors: Fache, Thibaud; Bordignon, Thomas; Perrose, Martin; Lucci, Luca; Gloria, Daniel; Adami, Obaid-Allah; Monsieur, Frédéric; Gouraud, Pascal; Kerdiles, Sébastien; Darras, François-Xavier; Acosta Alba, Pablo; Grégoire, Magali; Estellon, Adrien; Morris-Anak, Franco; Boughaleb, Sofia; Prouvee, Jérôme; Richard, Olivier; Guitard, Nicolas; Mohamad, Blend; Pavlovsky, Arthur; Ribotta, Mickael; Lachal, Laurent; Garros, Xavier; Chevalier, Pascal; Batude, Perrine
Contributors: Département Composants Silicium (DCOS); Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI); Direction de Recherche Technologique (CEA) (DRT (CEA)); Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Direction de Recherche Technologique (CEA) (DRT (CEA)); Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA); STMicroelectronics; Département Systèmes (DSYS); Département Plate-Forme Technologique (DPFT)
Source: IEDM 2025 - 2025 IEEE International Electron Devices Meeting ; https://cea.hal.science/cea-05506196 ; IEDM 2025 - 2025 IEEE International Electron Devices Meeting, Dec 2025, San Francisco, United States. ⟨10.1109/IEDM50572.2025.11353843⟩ ; https://ieeexplore.ieee.org/document/11353843
Publisher Information: CCSD
Publication Year: 2025
Collection: HAL-CEA (Commissariat à l'énergie atomique et aux énergies alternatives)
Subject Terms: [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
Subject Geographic: San Francisco; United States
Description: International audience ; This work demonstrates key solutions for the ultimate cointegration of SiGe HBT, PDSOI switches and high-quality passives with 3D sequential integration. A Local Trap Rich (LTR) with RF isolation comparable to the state of the-art TR substrate, and a bulk SiGe HBT withstanding the top tier thermal budget are shown. A high-performance RFSOI switch processed at 600°C featuring RON×COFF=96fs & RFVmax=2.7V is also demonstrated, which is a major breakthrough. Together, these results pave the way towards a fully monolithic Silicon Front-End Module (FEM) for advanced efficient and cost-effective RF systems.
Document Type: conference object
Language: English
DOI: 10.1109/IEDM50572.2025.11353843
Availability: https://cea.hal.science/cea-05506196; https://cea.hal.science/cea-05506196v1/document; https://cea.hal.science/cea-05506196v1/file/IEDM%20B55.pdf; https://doi.org/10.1109/IEDM50572.2025.11353843
Rights: https://about.hal.science/hal-authorisation-v1/ ; info:eu-repo/semantics/OpenAccess
Accession Number: edsbas.29AE7E1
Database: BASE