| Title: |
EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration |
| Authors: |
Ghosh, S.; Kruv, A.; Smets, Q.; Schram, T.; Leech, D. J.; Ding, T.; Turkani, V.; Groven, B.; Dangel, A.; Probst, G.; Uhrmann, T.; Wimplinger, M.; Asselberghs, I.; Lockhart de la Rosa, C. J.; Brems, S.; Kar, G. S. |
| Source: |
2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ; page 1-2 |
| Publisher Information: |
IEEE |
| Publication Year: |
2024 |
| Document Type: |
conference object |
| Language: |
unknown |
| DOI: |
10.1109/vlsitechnologyandcir46783.2024.10631364 |
| Availability: |
https://doi.org/10.1109/vlsitechnologyandcir46783.2024.10631364; http://xplorestaging.ieee.org/ielx8/10631290/10631310/10631364.pdf?arnumber=10631364 |
| Rights: |
https://doi.org/10.15223/policy-029 ; https://doi.org/10.15223/policy-037 |
| Accession Number: |
edsbas.3C201748 |
| Database: |
BASE |