| Title: |
Features of the occurrence of mechanical stresses in the semiconductor substrate when operating in thermal cycling mode |
| Authors: |
Koryachko, Marina; Pshonkin, Danila; Skvortsov, Arkady; Voloshinov, Evgeny; Guskov, Andrey |
| Contributors: |
Sadullozoda, Shahriyor; Abdullozoda, Ramazona |
| Source: |
Third International Conference on Optics, Computer Applications, and Materials Science (CMSD-III 2023) ; page 24 |
| Publisher Information: |
SPIE |
| Publication Year: |
2024 |
| Document Type: |
conference object |
| Language: |
unknown |
| DOI: |
10.1117/12.3024946 |
| Availability: |
https://doi.org/10.1117/12.3024946 |
| Accession Number: |
edsbas.5C9C76E |
| Database: |
BASE |