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Free Standing Stress Amplification Structure for Ultrasensitive 3C-SiC/Si Pressure Sensor

Title: Free Standing Stress Amplification Structure for Ultrasensitive 3C-SiC/Si Pressure Sensor
Authors: Tong, B; Nguyen, HQ; Nguyen, TH; Nguyen, TK; Nguyen, VT; Dinh, T; Vu, TH; Dau, VT; Dao, DV
Publisher Information: IEEE
Publication Year: 2022
Collection: Griffith University: Griffith Research Online
Subject Terms: Nanotechnology; Nanomaterials; Electronics; sensors and digital hardware; Materials engineering
Subject Geographic: Dallas; USA
Time: 2022-10-30 to 2022-11-02
Description: This paper presents an innovative stress amplification approach for enhancing the sensitivity of piezoresistive pressure sensors. The structure consists of two pillars raised from the membrane supporting a released 3C-SiC micro-beam which acts as the sensing element. The proposed design was demonstrated using a 3C-SiC/Si heterostructure. Experimental results found our device highly sensitive, with a high sensitivity of 0.1328 kPa-1. The sensitivity improvement was attributed to the stress-amplification phenomenon observed in our free-standing structure. Analytical and numerical methods confirmed that our device increases the stress/sensitivity by 750% over a traditional membrane structure. ; No Full Text
Document Type: conference object
Language: unknown
ISBN: 978-1-66548-464-0; 1-66548-464-0
Relation: Proceedings of 2022 IEEE Sensors; 2022 IEEE Sensors; Tong, B; Nguyen, HQ; Nguyen, TH; Nguyen, TK; Nguyen, VT; Dinh, T; Vu, TH; Dau, VT; Dao, DV, Free Standing Stress Amplification Structure for Ultrasensitive 3C-SiC/Si Pressure Sensor, Proceedings of 2022 IEEE Sensors, 2022; https://hdl.handle.net/10072/420518
DOI: 10.1109/SENSORS52175.2022.9967353
Availability: https://hdl.handle.net/10072/420518; https://doi.org/10.1109/SENSORS52175.2022.9967353
Rights: open access
Accession Number: edsbas.847C81C2
Database: BASE