| Title: |
Reliability Testing of Advanced Interconnect Materials |
| Authors: |
Keller, R. R.; Strus, M. C.; Chiaramonti, A. N.; Kim, Y. L.; Jung, Y. J.; Read, D. T.; Seiler, David G.; Diebold, Alain C.; McDonald, Robert; Chabli, Amal; Secula, Erik M. |
| Contributors: |
National Science Foundation |
| Source: |
AIP Conference Proceedings ; page 259-263 ; ISSN 0094-243X |
| Publisher Information: |
AIP |
| Publication Year: |
2011 |
| Document Type: |
conference object |
| Language: |
unknown |
| DOI: |
10.1063/1.3657900 |
| Availability: |
https://doi.org/10.1063/1.3657900 |
| Accession Number: |
edsbas.86F598BA |
| Database: |
BASE |