Katalog Plus
Bibliothek der Frankfurt UAS
Bald neuer Katalog: sichern Sie sich schon vorab Ihre persönlichen Merklisten im Nutzerkonto: Anleitung.
Dieses Ergebnis aus BASE kann Gästen nicht angezeigt werden.  Login für vollen Zugriff.

Fabrication of nitrogen-hyperdoped silicon by high-pressure gas immersion excimer laser doping

Title: Fabrication of nitrogen-hyperdoped silicon by high-pressure gas immersion excimer laser doping
Authors: Barkby J. W.; Moro F.; Perego M.; Taglietti F.; Lidorikis E.; Kalfagiannis N.; Koutsogeorgis D. C.; Fanciulli M.
Contributors: Barkby, J; Moro, F; Perego, M; Taglietti, F; Lidorikis, E; Kalfagiannis, N; Koutsogeorgis, D; Fanciulli, M
Publisher Information: Nature Publishing Group; GB
Publication Year: 2024
Collection: Università degli Studi di Milano-Bicocca: BOA (Bicocca Open Archive)
Subject Terms: Nitrogen; Silicon; Doping; Laser processing; FIS/03 - FISICA DELLA MATERIA; Settore PHYS-03/A - Fisica sperimentale della materia e applicazioni
Description: In recent years, research on hyperdoped semiconductors has accelerated, displaying dopant concentrations far exceeding solubility limits to surpass the limitations of conventionally doped materials. Nitrogen defects in silicon have been extensively investigated for their unique characteristics compared to other pnictogen dopants. However, previous practical investigations have encountered challenges in achieving high nitrogen defect concentrations due to the low solubility and diffusivity of nitrogen in silicon, and the necessary non-equilibrium techniques, such as ion implantation, resulting in crystal damage and amorphisation. In this study, we present a single-step technique called high-pressure gas immersion excimer laser doping (HP-GIELD) to manufacture nitrogen-hyperdoped silicon. Our approach offers ultrafast processing, scalability, high control, and reproducibility. Employing HP-GIELD, we achieved nitrogen concentrations exceeding 6 at% (3.01 x 10(21) at/cm(3)) in intrinsic silicon. Notably, nitrogen concentration remained above the liquid solubility limit to similar to 1 mu m in depth. HP-GIELD's high-pressure environment effectively suppressed physical surface damage and the generation of silicon dangling bonds, while the well-known effects of pulsed laser annealing (PLA) preserved crystallinity. Additionally, we conducted a theoretical analysis of light-matter interactions and thermal effects governing nitrogen diffusion during HP-GIELD, which provided insights into the doping mechanism. Leveraging excimer lasers, our method is well-suited for integration into high-volume semiconductor manufacturing, particularly front-end-of-line processes.
Document Type: article in journal/newspaper
File Description: ELETTRONICO
Language: English
Relation: info:eu-repo/semantics/altIdentifier/pmid/39179630; info:eu-repo/semantics/altIdentifier/wos/WOS:001297470500057; volume:14; issue:1; journal:SCIENTIFIC REPORTS; https://hdl.handle.net/10281/536202
DOI: 10.1038/s41598-024-69552-8
Availability: https://hdl.handle.net/10281/536202; https://doi.org/10.1038/s41598-024-69552-8
Rights: info:eu-repo/semantics/openAccess ; license:Creative Commons ; license uri:http://creativecommons.org/licenses/by/4.0/
Accession Number: edsbas.97569302
Database: BASE