| Title: |
3D integrated superconducting qubits |
| Authors: |
Rosenberg, D; Kim, D; Das, R; Yost, D; Gustavsson, S; Hover, D; Krantz, P; Melville, A; Racz, L; Samach, GO; Weber, SJ; Yan, F; Yoder, JL; Kerman, AJ; Oliver, WD |
| Contributors: |
Lincoln Laboratory; Massachusetts Institute of Technology. Research Laboratory of Electronics; Massachusetts Institute of Technology. Department of Physics |
| Source: |
Nature |
| Publisher Information: |
Springer Nature America, Inc |
| Publication Year: |
2021 |
| Collection: |
DSpace@MIT (Massachusetts Institute of Technology) |
| Description: |
As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence ($T_1$, $T_{2,\rm{echo}} > 20\,\mu$s) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips. |
| Document Type: |
article in journal/newspaper |
| File Description: |
application/pdf |
| Language: |
English |
| Relation: |
npj Quantum Information; https://hdl.handle.net/1721.1/136342 |
| Availability: |
https://hdl.handle.net/1721.1/136342 |
| Rights: |
Creative Commons Attribution 4.0 International license ; https://creativecommons.org/licenses/by/4.0/ |
| Accession Number: |
edsbas.9805A2F2 |
| Database: |
BASE |