| Title: |
3D Multilayered Ceramics - harsh environment interposer technologies expand into 3rd dimension |
| Authors: |
Ziesche, Steffen; Lenz, Christian; Müller-Köhn, Axel; Scheithauer, Uwe; Partsch, Uwe |
| Publication Year: |
2018 |
| Collection: |
Publikationsdatenbank der Fraunhofer-Gesellschaft |
| Subject Terms: |
thick-film technology; ceramic multilayer technology; folding; embossing; ceramic injection moulding; additive manufacturing; lithography based ceramic manufacturing; aerosol jet printing |
| Time: |
620; 666 |
| Description: |
5 S. ; The contribution deals with technologies to transform conventional planar ceramic interposers like thick film and multilayer ceramic substrates into functional 3D geometries comparable to polymer based Molded Interconnect Devices (MID). Different technological approaches like folding, cold and hot Embossing, Ceramic Injection Moulding and Additive Manufacturing are discussed. |
| Document Type: |
conference object |
| Language: |
English |
| Relation: |
Electronic System-Integration Technology Conference (ESTC) 2018; 7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings; KOMBIPIM; 17921 BR; https://publica.fraunhofer.de/handle/publica/403587 |
| DOI: |
10.1109/ESTC.2018.8546387 |
| Availability: |
https://publica.fraunhofer.de/handle/publica/403587; https://doi.org/10.1109/ESTC.2018.8546387 |
| Accession Number: |
edsbas.BFEE60CC |
| Database: |
BASE |