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Strain analysis of SiGe layers on SOI: A tip-enhanced Raman spectroscopy approach for accurate germanium and strain percentage determination

Title: Strain analysis of SiGe layers on SOI: A tip-enhanced Raman spectroscopy approach for accurate germanium and strain percentage determination
Authors: La Penna, Giancarlo; Proietti, Anacleto; Mancini, Chiara; Atanasio, Pierfrancesco; Buccini, Luca; Gambacorti, Narciso; Richy, Jérôme; Passeri, Daniele; Rossi, Marco
Contributors: Università degli Studi di Roma "La Sapienza" = Sapienza University Rome (UNIROMA); Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI); Direction de Recherche Technologique (CEA) (DRT (CEA)); Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA); Département Plate-Forme Technologique (DPFT); Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Direction de Recherche Technologique (CEA) (DRT (CEA))
Source: ICORS 2024 - 28th International Conference on Raman Spectroscopy ; https://cea.hal.science/cea-04770506 ; ICORS 2024 - 28th International Conference on Raman Spectroscopy, Jul 2024, Rome, Italy. 2024
Publisher Information: CCSD
Publication Year: 2024
Collection: HAL-CEA (Commissariat à l'énergie atomique et aux énergies alternatives)
Subject Terms: [CHIM.MATE]Chemical Sciences/Material chemistry; [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
Subject Geographic: Rome; Italy
Description: International audience ; In recent years, strained silicon technologies have emerged as a key avenue in semiconductor research, offering a promising way to improve device performance. Among the key players in this field is the integration of silicon-germanium (SiGe) layers onto silicon substrates, which are strategically designed to induce strain and subsequently increase the overall efficiency of strained silicon devices [1].In this work, through a weighted comparison of Raman spectroscopy and high-resolution X-ray diffraction (HR-XRD) measurements with Tip-Enhanced Raman Spectroscopy (TERS) [2] measurements obtained on SiGe changes on SOI at different concentrations and thicknesses, a model was extracted that allows the simultaneous measurement of the percentage of Ge and strain present in nanometric volumes [3]. Furthermore, also the innovative titanium nitride (TiN) AFM probe [4], which allows clean room implementation for in-line characterisation, was used.The results highlight TERS as a powerful tool for monitoring the quality of semiconductor production lines, with unprecedented resolution and speed.
Document Type: conference object; still image
Language: English
Availability: https://cea.hal.science/cea-04770506; https://cea.hal.science/cea-04770506v1/document; https://cea.hal.science/cea-04770506v1/file/ICORS_XXVIII_Abstract_Template_2024_Blanket.pdf
Rights: info:eu-repo/semantics/OpenAccess
Accession Number: edsbas.CCB2C006
Database: BASE