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Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems

Title: Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems
Authors: van Steenberge, Geert; Roelkens, Günther C.; Ossieur, Peter; Missinne, Jeroen; van Asch, Jef; Zhang, Jing; Qin, Senbiao; Van Campenhout, Joris; van Kerkhof, Joost; Milosevic, Milan M.; Bakopoulos, Paraskevas; Syrivelis, Dimitris; Mentovich, Elad D.; Morozov, Konstantin M.; Stracca, Stefano; Bigongiari, Alessandra; Joerg, T.; Schlick, Daniel; Braun, Tanja; Woehrmann, Markus; Gernhardt, Robert; Cheng, Qixiang; Li, Tongyun; Penty, Richard V.
Publication Year: 2023
Collection: Publikationsdatenbank der Fraunhofer-Gesellschaft
Subject Terms: FOWLP; high-density substrates; micro-transfer-printing; optical redistri-bution layer; photonic integration and packaging; scalable; switch fabric
Description: 742 ; 747 ; We report the development of a fully non-blocking optical switch fabric, enabling a deterministic and dynamic network infrastructure. Focus is on scalable photonic integration and packaging technologies required to develop a low-cost switch fabric, including micro-transfer-printing of amplifiers, FOWLP for dense photonic-electronic integration, and optical/thermal packaging solutions on IC-substrates.
Document Type: conference object
Language: English
ISBN: 979-83-503-3498-2
ISSN: 05695503
Relation: 73rd IEEE Electronic Components and Technology Conference, ECTC 2023; Proceedings Electronic Components and Technology Conference; 101070560; https://publica.fraunhofer.de/handle/publica/507140
DOI: 10.1109/ECTC51909.2023.00129
Availability: https://publica.fraunhofer.de/handle/publica/507140; https://doi.org/10.1109/ECTC51909.2023.00129
Rights: false
Accession Number: edsbas.CE08564D
Database: BASE