| Title: |
3D design activities at Fermilab: Opportunities for physics |
| Authors: |
Yarema, Raymond; Deptuch, Grezgorz; Hoff, Jim; Shenai, Alpana; Trimpl, Marcel; Zimmerman, Tom; Demarteau, Marcel; Liptona, Ron; Christian, Dave |
| Contributors: |
United States. Department of Energy. |
| Source: |
Nucl.Instrum.Meth.A617:375-377,2010; Journal Volume: 617; Journal Issue: 1-3 ; Prepared for 11th Pisa Meeting on Advanced Detectors: Frontier Detectors for Frontier Physics, La Biodola, Isola d'Elba, Italy, 24-30 May 2009 |
| Publisher Information: |
Fermi National Accelerator Laboratory |
| Publication Year: |
2009 |
| Collection: |
University of North Texas: UNT Digital Library |
| Subject Terms: |
Accelerators; Instrumentation; Silicon Accelerators; Physics; Design; High Energy Physics; Integrated Circuits; 43 Particle Accelerators; 46 Instrumentation Related To Nuclear Science And Technology; Bonding; Fermilab |
| Description: |
Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest. |
| Document Type: |
article in journal/newspaper |
| File Description: |
Text |
| Language: |
English |
| Relation: |
osti: 985425; https://digital.library.unt.edu/ark:/67531/metadc1012458/; ark: ark:/67531/metadc1012458 |
| Availability: |
https://digital.library.unt.edu/ark:/67531/metadc1012458/ |
| Accession Number: |
edsbas.DAE7702D |
| Database: |
BASE |