The ABC130 barrel module prototyping programme for the ATLAS strip tracker
| Title: | The ABC130 barrel module prototyping programme for the ATLAS strip tracker |
|---|---|
| Authors: | Poley, L.; Sawyer, C.; Addepalli, S.; Affolder, A. A.; Allongue, B.; Allport, P.; Anderssen, E.; Anghinolfi, F.; Arguin, J-F; Arling, J-H; Arnaez, O.; Asbah, N. A.; Ashby, J.; Asimakopoulou, Eleni M.; Atlay, N. B.; Bartsch, L.; Basso, M. J.; Beacham, J.; Beaupre, S. L.; Beck, G.; Beichert, C.; Bergsten, L.; Bernabeu, J.; Bhattarai, P.; Bloch, I; Blue, A. J.; Bochenek, M.; Botte, J.; Boynton, L.; Brenner, Richard; Brueers, B.; Buchanan, E.; Bullard, B.; Capocasa, F.; Carr, I; Carra, S.; Chao, C. W.; Chen, J.; Chen, L.; Chen, Y.; Chen, X.; Cindro, V; Ciocio, A.; Civera, J. , V; Cormier, K.; Cornell, E.; Crick, B.; Dabrowski, W.; Dam, M.; David, C.; Demontigny, G.; Dette, K.; DeWitt, J.; Diez, S.; Doherty, F.; Dopke, J.; Dressnandt, N.; Edwards, S.; Fadeyev, V; Farrington, S.; Fawcett, W.; Fernandez-Tejero, J.; Filmer, E.; Fleta, C.; Gallop, B.; Galloway, Z.; Argos, C. Garcia; Garg, D.; Gignac, M.; Gillberg, D.; Giovinazzo, D.; Glover, J.; Goettlicher, P.; Gonella, L.; Gorisek, A.; Grant, C.; Grant, F.; Gray, C.; Greenall, A.; Gregor, I; Greig, G.; Grillo, A. A.; Gu, S.; Guescini, F.; da Costa, J. Barreiro Guimaraes; Gunnell, J.; Gupta, R.; Haber, C.; Halgheri, A.; Hamersly, D.; Haugen, T. E.; Hauser, M.; Heim, S.; Heim, T.; Helling, C.; Herde, H.; Hessey, N. P.; Hommels, B.; Hoenig, J. C.; Hunter, A.; Jackson, P.; Jewkes, K.; John, J. J.; Johnson, T. A.; Jones, T.; Kachiguin, S.; Kang, N.; Kaplon, J.; Kareem, M.; Keener, P.; Keller, J.; Key-Charriere, M.; Kilani, S.; Kisliuk, D.; Klein, C. T.; Koffas, T.; Kramberger, G.; Krizka, K.; Kroll, J.; Kuehn, S.; Kurth, M.; Labitan, C.; Lacasta, C.; Lacker, H.; Leon, P.; Li, B.; Li, C.; Li, Y.; Li, Z.; Liang, Z.; Liberatore, M.; Lister, A.; Liu, K.; Liu, P.; Lohse, T.; Loenker, J.; Lou, X.; Lu, W.; Luce, Z.; Lynn, D.; MacFadyen, R.; Maegdefessel, S.; Mahboubi, K.; Malik, U.; Mandic, I; La Marra, D.; Martin, J.; Martinez-Mckinney, F.; Mikestikova, M.; Mikuz, M.; Mitra, A.; Mladina, E.; Montalbano, A.; Monzat, D.; Morii, M.; Mullier, G.; Neundorf, J.; Newcomer, M.; Ng, Y.; Nikolica, A.; Nikolopoulos, K.; Oechsle, J.; Oliver, J.; Orr, R. S.; Ottino, G.; Paillard, C.; Pani, P.; Paowell, S.; Parzefall, U.; Phillips, P. W.; Platero, A.; Platero, V; Prahl, V; Pyatt, S.; Ran, K.; Reardon, N.; Rehnisch, L.; Renardi, A.; Renzmann, M.; Rifki, O.; Rodriguez, A. Rodriguez; Rosin, G.; Rossi, E.; Ruggeri, T.; Ruehr, F.; Rymaszewski, P.; Sadrozinski, H. F-W; Sanethavong, P.; Santpur, S. Neha; Scharf, C.; Schillaci, Z.; Schmitt, S.; Sharma, A.; Sciolla, G.; Seiden, A.; Shi, X.; Simpson-Allsop, C.; Snoek, H.; Snow, S.; Solaz, C.; Soldevila, U.; Sousa, F.; Sperlich, D.; Staats, E.; Stack, T. L.; Stanitzki, M.; Starinsky, N.; Steentoft, Jonas; Stegler, M.; Stelzer, B.; Stucci, S.; Swientek, K.; Taylor, G. N.; Taylor, W.; Teoh, J. Jian; Teuscher, R.; Thomas, J.; Tigchelaar, A.; Tran, T.; Tricoli, A.; Trischuk, D. A.; Unno, Y.; van Nieuwenhuizen, G.; Ullan, M.; Vermeulen, J.; Leitao, P. Vicente; Vickey, T.; Vidal, G.; Vreeswijk, M.; Warren, M.; Weidberg, T.; Wiehe, M.; Wiglesworth, C.; Wiik-Fuchs, L.; Williams, S.; Wilson, J.; Witharm, R.; Wizemann, F.; Wonsak, S.; Worm, S.; Wormald, M.; Xella, S.; Yang, Y.; Yarwick, J.; Yu, T.; Zhang, D.; Zhang, K.; Zhou, M.; Zhu, H. |
| Publisher Information: | Uppsala universitet, Högenergifysik; Lawrence Berkeley Natl Lab, Cyclotron Rd, Berkeley, CA 94720 USA.; STFC Rutherford Appleton Lab, Particle Phys Dept, Harwell Sci & Innovat Campus, Didcot, Oxon, England.; Brandeis Univ, Martin A Fisher Sch Phys, Waltham, MA USA.; Univ Calif Santa Cruz, Santa Cruz Inst Particle Phys, High St, Santa Cruz, CA 95064 USA.; CERN, Expt Phys Dept, Geneva, Switzerland.; Univ Birmingham, Sch Phys & Astron, Birmingham, W Midlands, England.; Univ Montreal, Grp Particle Phys, Rue Univ, Montreal, PQ, Canada.; DESY, Notkestr, Hamburg, Germany.; Univ Toronto, Dept Phys, St George St, Toronto, ON, Canada.; Harvard Univ, Jefferson Lab Phys, Oxford St, Cambridge, MA 02138 USA.; Univ Glasgow, SUPA Sch Phys & Astron, Univ Ave, Glasgow, Lanark, Scotland.; Humboldt Univ, Inst Phys, Berlin, Germany.; Duke Univ, Dept Phys, Sci Dr, Durham, NC 27706 USA.; Simon Fraser Univ, Dept Phys, Univ Dr W, Burnaby, BC, Canada.; Queen Mary Univ London, Sch Phys & Astron, Mile End Rd, London, England.; Univ Valencia, Inst Fis Corpuscular, CSIC, C Catedrat Jose Beltran, Paterna, Spain.; Univ Penn, Dept Phys & Astron, South 33rd St, Philadelphia, PA 19104 USA.; Carleton Univ, Dept Phys, Colonel Dr, Ottawa, ON, Canada.; Univ Liverpool, Dept Phys, Oxford St, Liverpool, Merseyside, England.; Inst High Energy Phys, Yuquan Rd, Beijing, Peoples R China.;State Key Lab Particle Detect & Elect, Beijing, Peoples R China.; Univ Melbourne, Sch Phys, Swanston St, Parkville, Vic, Australia.; Inst High Energy Phys, Yuquan Rd, Beijing, Peoples R China.;State Key Lab Particle Detect & Elect, Beijing, Peoples R China.;Univ Chinese Acad Sci, Yuquan Rd, Beijing, Peoples R China.; Tsinghua Univ, Dept Phys, Beijing, Peoples R China.; Univ Ljubljana, Jozef Stefan Inst, Jadranska Ulica, Ljubljana, Slovenia.;Univ Ljubljana, Dept Phys, Jadranska Ulica, Ljubljana, Slovenia.; AGH Univ Sci & Technol, Fac Phys & Appl Comp Sci, Al Mickiewicza, Krakow, Poland.; Univ Copenhagen, Niels Bohr Inst, Copenhagen, Denmark.; York Univ, Dept Phys & Astron, Keele St, Toronto, ON, Canada.; Univ Sheffield, Dept Phys & Astron, Hounsfield Rd, Sheffield, S Yorkshire, England.; Univ Warwick, Dept Phys, Coventry, W Midlands, England.; Cavendish Lab, Dept Phys, JJ Thomson Ave, Cambridge, England.; Ctr Nacl Microelect IMB CNM, Campus UAB Bellaterra, Barcelona, Spain.; Univ Adelaide, Dept Phys, Adelaide, SA, Australia.; Albert Ludwigs Univ Freiburg, Phys Inst, Hermann Herder Str, Freiburg, Germany.; Univ Iowa, Dept Phys & Astron, Iowa City, IA 52242 USA.; Beihang Univ, Xueyuan Rd, Beijing, Peoples R China.; TRIUMF, Vancouver, BC, Canada.; Univ Oxford, Phys Dept, Keble Rd, Oxford, England.; UCL, Dept Phys & Astron, Gower St, London, England.; Czech Acad Sci, Inst Phys, Prague, Czech Republic.; Lawrence Berkeley Natl Lab, Cyclotron Rd, Berkeley, CA 94720 USA.;Tsinghua Univ, Dept Phys, Beijing, Peoples R China.; Univ British Columbia, Dept Phys, Agr Rd, Vancouver, BC, Canada.; Tech Univ Dortmund, Lehrstuhl Expt Phys 4, Otto Hahn Str, Dortmund, Germany.; Brookhaven Natl Lab, Rochester St, Upton, NY 11973 USA.; Univ Geneva, Dept Phys Nucl & Corpusculaire, Geneva, Switzerland.; Lund Univ, Div Particle Phys, Lund, Sweden.; Univ Massachusetts, Dept Phys, North Pleast St, Amherst, MA 01003 USA.; Univ Amsterdam, Nikhef Natl Inst Subat Phys, Sci Pk, Amsterdam, Netherlands.; KEK, Inst Particle & Nucl Study, Tsukuba, Ibaraki, Japan.; Univ Birmingham, Sch Phys & Astron, Birmingham, W Midlands, England.;DESY, Notkestr, Hamburg, Germany.; IOP PUBLISHING LTD |
| Publication Year: | 2020 |
| Collection: | Uppsala University: Publications (DiVA) |
| Subject Terms: | Detector design and construction technologies and materials; Si microstrip and pad detectors; Radiation-hard detectors; Front-end electronics for detector readout; Subatomic Physics; Subatomär fysik |
| Description: | For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2, 3] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests. |
| Document Type: | article in journal/newspaper |
| File Description: | application/pdf |
| Language: | English |
| Relation: | Journal of Instrumentation, 2020, 15:9; ISI:000577273400004 |
| DOI: | 10.1088/1748-0221/15/09/P09004 |
| Availability: | http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-423939; https://doi.org/10.1088/1748-0221/15/09/P09004 |
| Rights: | info:eu-repo/semantics/openAccess |
| Accession Number: | edsbas.EE3A05F3 |
| Database: | BASE |