| Title: |
Solder-Reflow Resistant Thermoplastic for Optical Coupling |
| Authors: |
Gradkowski, Kamil; Hoogland, Gabrie; Johnson, Peter M.; van Gisbergen, Jos; Choi, Young-Joon; Jung, Florian; Hartwig, Alexander; Pitwon, Richard; O’Brien, Peter |
| Contributors: |
Taighde Éireann-Research Ireland; Saudi Basic Industries Corporation |
| Source: |
IEEE Transactions on Components, Packaging and Manufacturing Technology ; volume 15, issue 8, page 1636-1643 ; ISSN 2156-3950 2156-3985 |
| Publisher Information: |
Institute of Electrical and Electronics Engineers (IEEE) |
| Publication Year: |
2025 |
| Document Type: |
article in journal/newspaper |
| Language: |
unknown |
| DOI: |
10.1109/tcpmt.2025.3532026 |
| Availability: |
https://doi.org/10.1109/tcpmt.2025.3532026; http://xplorestaging.ieee.org/ielx8/5503870/11134680/10850755.pdf?arnumber=10850755 |
| Rights: |
https://creativecommons.org/licenses/by/4.0/legalcode |
| Accession Number: |
edsbas.FBCC4B4 |
| Database: |
BASE |