The Relationship between Packaging Structures, Chip Area and Thermal Resistance of NMOS Semiconductor in Transient Dual Interface Method
| Title: | The Relationship between Packaging Structures, Chip Area and Thermal Resistance of NMOS Semiconductor in Transient Dual Interface Method |
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| Authors: | Chen, Fan; Liu, Dapeng; Chen, Long; Tao, Shuai; You, Jun; Kong, Zebin |
| Source: | Proceedings of the 2021 5th International Conference on Electronic Information Technology and Computer Engineering. :39-43 |
| Availability: | http://dl.acm.org/doi/10.1145/3501409.3501417 |
| Database: | ACM Full-Text Collection |