| Title: |
The Impact of Environment Humidity on WS Paste Characteristics |
| Authors: |
Fen, Zhang Rui; Jason, Lim Chze Min; Huei, Yam Lip; Kumar, Balasubramanian Senthil; Murali, Sarangapani; Wen, Zhang Han; Sungsig, SS Kang; Li-San, Chan |
| Source: |
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :486-489 Dec, 2022 |
| Relation: |
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |