| Title: |
Thermal and RF Characterization of Novel PLA/Flax Based Biodegradable Printed Circuit Boards |
| Authors: |
Geczy, Attila; Csiszar, Andras; Xavier, Pascal; Corrao, Nicolas; Rauly, Dominique; Kovacs, Robert; Feher, Anna Eva; Rozs, Egon; Gal, Laszlo |
| Source: |
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :329-333 Dec, 2022 |
| Relation: |
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |