| Title: |
Microstructural and mechanical integrity of Cu/Cu joints formed through transient liquid bonding with Cu-Sn nanocomposite interlayer |
| Authors: |
Jiang, Han; Robertson, Stuart; Liang, Shuibao; Zhou, Zhaoxia; Zhao, Liguo; Liu, Changqing |
| Source: |
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :964-968 Dec, 2022 |
| Relation: |
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |