Development of OE integrated surface mount packaging
| Title: | Development of OE integrated surface mount packaging |
|---|---|
| Authors: | Kishida, Y.; Kuba, Y.; Komeda, R.; Okumichi, T.; Setoguchi, K.; Matsubara, T. |
| Source: | 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :574-577 2002 |
| Relation: | Proceedings of 52nd Electronic Components and Technology Conference |
| Database: | IEEE Xplore Digital Library |