Effect of adhesive layer properties on interfacial fracture in thin-film high-density interconnects
| Title: | Effect of adhesive layer properties on interfacial fracture in thin-film high-density interconnects |
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| Authors: | Modi, M.; Sitaraman, S.K. |
| Source: | 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :847-853 2002 |
| Relation: | Proceedings of 52nd Electronic Components and Technology Conference |
| Database: | IEEE Xplore Digital Library |