| Title: |
Comprehensive design analysis of QFN and PowerQFN packages for enhanced board level solder joint reliability |
| Authors: |
Tong Yan Tee; Hun Shen Ng; Diot, J.-L.; Frezza, G.; Tiziani, R.; Santospirito, G. |
| Source: |
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :985-991 2002 |
| Relation: |
Proceedings of 52nd Electronic Components and Technology Conference |
| Database: |
IEEE Xplore Digital Library |