| Title: |
A Simulation-Based Design Approach for Optimized Performance of Cu-Mo-Cu Clips in High-Power Semiconductor Modules |
| Authors: |
Packwood, Matthew; Li, Xiang; Morshed, Muhammad; Neal, Harley; Wang, Yangang |
| Source: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-7 Apr, 2023 |
| Relation: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Database: |
IEEE Xplore Digital Library |