| Title: |
Electromigration in tin-bismuth planar solder joints |
| Authors: |
Singh, Prabjit; Palmer, L.; Hamid, M.; Wassick, T.; Aspandiar, R. F.; Franco, B.; Fu, H.; Coyle, Richard; Hadian, Faramarz; Vasudevan, V.; Allen, A.; Howell, K.; Murayama, K.; Zhang, H.; Lifton, A.; Ribas, M.; Sarangapani, M.; Munson, T.; Middleton, S. |
| Source: |
2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :201-202 Apr, 2023 |
| Relation: |
2023 International Conference on Electronics Packaging (ICEP) |
| Database: |
IEEE Xplore Digital Library |