Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging
| Title: | Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging |
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| Authors: | Yang, Y.; Zhou, L.; Zayed, O.; Alizadeh, M.; Stevanovic, D.; Narimani, M.; Emadi, A. |
| Source: | IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 38(9):11277-11289 Sep, 2023 |
| Database: | IEEE Xplore Digital Library |