Copper Pillar Voids in a Flip Chip Package During High Temperature Application
| Title: | Copper Pillar Voids in a Flip Chip Package During High Temperature Application |
|---|---|
| Authors: | Wang, Miao; Mavinkurve, Amar; Roucou, Romuald; Afripin, Amirul; Uehling, Trent; Foong, Cs; Lakhera, Nishant |
| Source: | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :852-857 May, 2023 |
| Relation: | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |