Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics
| Title: | Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics |
|---|---|
| Authors: | Li, Jay; Hsu, Terry; Zhuan, Ming-Han; Lin, Sam; Shih, Teny; Kao, Nicholas; Wang, Yu-Po |
| Source: | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :228-232 May, 2023 |
| Relation: | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |