Ultimate Layer Stacking Technology for High Density Sequential 3D Integration
| Title: | Ultimate Layer Stacking Technology for High Density Sequential 3D Integration |
|---|---|
| Authors: | Radu, I.; Nguyen, B-Y.; Chang, C-H.; Neve, C. Roda; Gaudin, G.; Besnard, G.; Batude, P.; Loup, V.; Brunet, L.; Vandooren, A.; Horiguchi, N. |
| Source: | 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023 |
| Relation: | 2023 International Electron Devices Meeting (IEDM) |
| Database: | IEEE Xplore Digital Library |