Wafer Bonding as Next Generation Scaling Booster
| Title: | Wafer Bonding as Next Generation Scaling Booster |
|---|---|
| Authors: | Wernicke, T.; Lindner, P.; Uhrmann, T.; Wimplinger, M. |
| Source: | 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023 |
| Relation: | 2023 International Electron Devices Meeting (IEDM) |
| Database: | IEEE Xplore Digital Library |