| Title: |
Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging |
| Authors: |
Singh, Prashant Kumar; Rohlfs, Patrick; Sandmann, Gunther; Machani, Kashi Vishwanath; Breuer, Dirk; Meier, Karsten; Kuechenmeister, Frank; Wieland, Marcel; Bock, Karlheinz |
| Source: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023 |
| Relation: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: |
IEEE Xplore Digital Library |