| Title: |
Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames |
| Authors: |
Martin, Henry; Cao, Xinpei; Wijgaerts, Jan; Smits, Edsger; Xia, Bo; de Wit, Ruud |
| Source: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-8 Sep, 2023 |
| Relation: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: |
IEEE Xplore Digital Library |