| Title: |
In Situ Study of Electromigration in Eutectic Tin-Bismuth Planar Solder Joints |
| Authors: |
Singh, Prabjit; Palmer, L.; Hamid, M.; Wassick, T.; Campbell, E.; Aspandiar, R. F.; Franco, B.; Fu, H.; Vasudevan, V.; Allen, A.; Howell, K.; Murayama, K.; Zhang, H.; Lifton, A.; Munson, T.; Middleton, S.; Coyle, Richard; Sarangapani, M. |
| Source: |
2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific) Pan Pacific Strategic Electronics Symposium (Pan Pacific), 2024. :1-6 Jan, 2024 |
| Relation: |
2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific) |
| Database: |
IEEE Xplore Digital Library |