| Title: |
Development of micron-sized Ag-Si composite paste die attach material for highly stable microstructure during high temperate aging |
| Authors: |
Chen, Chuantong; Liu, Yang; Li, Wangyun; Ueshima, Minoru; Nakayama, Koji; Suganuma, Katsuaki |
| Source: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :548-551 Dec, 2023 |
| Relation: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |