| Title: |
Integration of plasma dicing in the collective die to wafer hybrid bonding process |
| Authors: |
Suhard, Samuel; Kennes, Koen; Bex, Pieter; Georgieva, Violeta; Schleicher, Filip; Walsby, Edward; Barnett, Richard; Jourdain, Anne; Beyer, Gerald; Beyne, Eric |
| Source: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :144-149 Dec, 2023 |
| Relation: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |