| Title: |
Packaging strategies for 3D integration of Photonic and Electronic chips on a Glass substrate |
| Authors: |
Bernson, Robert; Wakeel, Saif; Gupta, Parnika; Ranno, Luigi; Weninger, Drew; Agarwal, Anuradha; Serna, Samuel; Hu, Juejun; Gradkowski, Kamil; Kimerling, Lionel; O'Brien, Peter |
| Source: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :804-808 Dec, 2023 |
| Relation: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |