| Title: |
Detection of bonding voids in multi-tier stacks with scanning acoustic microscope |
| Authors: |
Chen, Cong; Slabbekoorn, John; Bogdanowicz, Janusz; Moussa, Alain; Zhang, Boyao; Schleicher, Filip; Hoffrogge, Peter; Wiesler, Ingo; Khaldi, Wassim; Phommahaxay, Alain; Beral, Christophe; Beyer, Gerald; Beyne, Eric; Charley, Anne-Laure; Leray, Philippe |
| Source: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :320-325 Dec, 2023 |
| Relation: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |