Flip Chip CSP Package Integrity and Reliability Evaluation
| Title: | Flip Chip CSP Package Integrity and Reliability Evaluation |
|---|---|
| Authors: | Liu, J.M; Yao, J.Z; Wei, Peter; Jiang, Ruby; Pang, Xingshou; Xu, Sean; Li, Leo |
| Source: | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :340-345 Dec, 2023 |
| Relation: | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |