| Title: |
Development of Crossflow Manifold for Two-Phase Liquid Cooling of 3D ICs via 3D Printing |
| Authors: |
Feng, Huicheng; Tang, Gongyue; Zhang, Xiaowu; Lau, Boon Long; Jong, Ming Chinq; Au, Keng Yuen Jason; Ong, Jun Wei Javier; Chui, King Jien; Li, Jun; Li, Hongying; Le, Duc Vinh; Lou, Jing |
| Source: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1012-1016 Dec, 2023 |
| Relation: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |