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Thermal multiscale simulation of a FO-WLP SiP including a GaN Power Amplifier

Title: Thermal multiscale simulation of a FO-WLP SiP including a GaN Power Amplifier
Authors: Kakou, N'Doua Luc Arnaud; Sommet, Raphael; Brunel, Laurent; Bortolussi, Vincent; Lambert, Benoit; Nallatamby, Jean-Christophe
Source: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-4 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Database: IEEE Xplore Digital Library