Study on ELK Dielectric Reliability During the Solder Reflow Process Based on Finite Element Simulations
| Title: | Study on ELK Dielectric Reliability During the Solder Reflow Process Based on Finite Element Simulations |
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| Authors: | Zheng, Jialin; Zhao, Yunong; Wang, Zhuqiu; Lin, Shaobin; Yang, Dan; Mei, Na |
| Source: | 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) Science and Technology for Integrated Circuits (CSTIC), 2024 Conference of. :1-4 Mar, 2024 |
| Relation: | 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) |
| Database: | IEEE Xplore Digital Library |