| Title: |
Comparing Electromigration in Tin-Bismuth Alloys using planar geometry solder joints |
| Authors: |
Singh, Prabjit; Palmer, L.; Wassick, T.; Hamid, M; Campbell, Eric; Aspandiar, R. F.; Franco, B.; Fu, H.; Coyle, Richard; Vasudevan, V.; Allen, A.; Howell, K.; Murayama, K.; Zhang, H.; Lifton, A.; Munson, T.; Middleton, S.; Sarangapani, M. |
| Source: |
2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :55-56 Apr, 2024 |
| Relation: |
2024 International Conference on Electronics Packaging (ICEP) |
| Database: |
IEEE Xplore Digital Library |