| Title: |
Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers |
| Authors: |
Kang, Shuo; Iacovo, Serena; D'have, Koen; Huylenbroeck, Stefaan Van; Orkut Okudur, Oguzhan; Alexeev, Anton; Plach, Thomas; Probst, Gernot; Ding, Taotao; Wimplinger, Markus; Uhrmann, Thomas; Vos, Joeri De; Beyer, Gerald; Beyne, Eric |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :386-393 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |