| Title: |
3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators |
| Authors: |
Mandalapu, Chandra Sekhar; Buch, Chintan; Shah, Priyal; Topacio, Roden; Cheng, Patrick; Wang, Liwei; Swaminathan, Raja; Smith, Alan; Wuu, John; Mysore, Kaushik; Alam, Arsalan |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :798-802 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |