| Title: |
Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-Component Solder Joints |
| Authors: |
Singh, P.; Palmer, L.; Wassick, T.; Aspandiar, R. F.; Franco, B.; Fu, H.; Vasudevan, V.; Allen, A.; Howell, K.; Murayama, K.; Zhang, H.; Lifton, A.; Munson, T.; Middleton, S.; Coyle, R.; Murali, S. |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1433-1438 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |