| Title: |
Development of UV-curable molding materials with minimum die-shift for FOWLP/FOPLP |
| Authors: |
Schindler, Markus; Ringelstetter, Severin; Pires, Mariana; Begel, Mikhail; Kneidinger, Andrea; Kleinpotzl, Florian; Uhrmann, Thomas; Wimplinger, Markus; Brandl, Elisabeth |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :860-864 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |