| Title: |
Next Generation Large Size High Interconnect Density CoWoS-R Package |
| Authors: |
Lee, Chien-Hsun; Hu, YH; Chen, SM; Lai, CL; Liu, M; Chen, HY; Lin, J; Yew, MC; Hsu, CK; Chiu, MY; Chen, CH; Chou, MW; Chen, WC; Chang, J; Hsieh, C.C.; Chen, CS; Chen, HW; Wang, CT; Yan, Kathy; Jeng, Shin-Puu; He, Jun |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :259-263 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |