| Title: |
0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer |
| Authors: |
Ma, Kai; Bekiaris, Nikolaos; Hsu, Ching-Hsiang; Xue, Lei; Ramaswami, Sesh; Ding, Taotao; Probst, Gernot; Wernicke, Tobias; Uhrmann, Thomas; Wimplinger, Markus |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :331-336 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |