Fiber-to-Chip Packaging With Robust Fiber Fusion Splicing for Low-Temperature Applications
| Title: | Fiber-to-Chip Packaging With Robust Fiber Fusion Splicing for Low-Temperature Applications |
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| Authors: | Hutchins, A.; Reens, D.; Kharas, D.; West, G.N.; Sorace-Agaskar, C.; Chiaverini, J.; McConnell, R.; Swint, R.; Akanbi, O.; Harding, S.; Guo, W. |
| Source: | IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 36(19):1209-1212 Oct, 2024 |
| Database: | IEEE Xplore Digital Library |