| Title: |
Co-Design of 300 mm Wafer Scale Package |
| Authors: |
Schleupen, Kai; Colgan, Evan G.; Anzola, Diego; Kuder, Robert P.; Mann, Phillip; Pear, Brian; Speidell, James L. |
| Source: |
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-8 May, 2024 |
| Relation: |
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| Database: |
IEEE Xplore Digital Library |