| Title: |
High Heat Flux Thermal Management using CuW Microchannel Heat Sinks and FC3283 |
| Authors: |
Amyx, Isabella; Anderson, Caleb; Cassada, Nicole; Funaro, Devin; Frye, Clint; Baxamusa, Salmaan; Kotovsky, Jack; Jackson, Kathy; Bandhauer, Todd |
| Source: |
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-5 May, 2024 |
| Relation: |
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| Database: |
IEEE Xplore Digital Library |